双马来酰亚胺/氰酸酯型发泡胶的制备与表征

Preparation and Characterization of Bismaleimide Foam Adhesive

以4,4’-双马来酰亚胺二苯甲烷(BMI-1)、双酚A型氰酸酯(BADCy)和酚酞型聚芳醚砜(PES-C)为原料通过加入发泡剂合成了双马来酰亚胺/氰酸酯耐高温发泡胶。通过差示扫描量热分析和红外表征分析了树脂的固化行为。扫描电子显微镜分析表明,该发泡胶发泡均匀细腻(平均泡孔直径0.275 mm)。热重分析结果表明,该发泡胶具有很高的耐温性:空气和氮气氛围下10%分解温度分别为393℃和412℃。发泡胶在9.375 GHz频率下的介电常数为1.65、介电损耗为0.0057,展现了优异的介电性能。管剪测试表明,该发泡胶具有优异的黏结性能和耐温性能,-55℃、25℃和150℃管剪强度均大于7 MPa,205℃管剪强度不小于4 MPa。与多种材料的拉伸测试结果表明,该发泡胶与多种材料具有优异的黏结性能,铝-铝拉伸强度为9.2 MPa、钛-钛拉伸强度为5.9 MPa、双马基复材-双马基复材拉伸强度为5.9 MPa。

A high temperature resistant bismaleimide/cyanate foam adhesive was synthesized with 4,4’-bismaleimide diphenylmethane(BMI-1),bisphenol A dicyanate(BADCy),phenolphthalein polyaryl ether sulfone(PES-C)and blowing agent.The cure reaction of the resin was investigated by differential scanning calorimetry(DSC),in situ FT-IR.SEM analysis suggest the foam evenly with fine cells,the average cell diameter is 0.275 mm.Thermogravimetric analyzer(TGA)suggests that the foam adhesive has a higher temperature resistance,Td10 in air and nitrogen atmosphere is 393℃and 412℃,respectively.At 9.375 GHz,the dielectric constant of foam is 1.65,tanδis 0.0057,showing excellent dielectric properties.Pipe shear test shows that it has excellent bonding performance and the temperature resistance-55℃,25℃and 150℃pipe shear strength is not less 7 MPa,205℃pipe shear strength is greater than 4 MPa.Tensile test of the foam adhesive with a variety of materials shows that it has excellent bonding properties to a variety of materials,aluminum-aluminum tensile strength is 9.2 MPa,titanium-titanium tensile strength is 5.9 MPa,bismaleimide composite material-bismaleimide composite material strength is 5.9 MPa.