贯通式液冷模块均温性控制研究

Research on Control of Inter Temperature Uniformity for Liquid Flow Through Module

随着微电子技术的迅猛发展,芯片的热功耗与热流密度越来越大,贯通式液体冷却技术逐渐成为解决此类芯片散热问题的主要冷却方式之一。在一些应用场景中,同一个贯通式液冷模块上对同型号的多个芯片的均温性有十分苛刻的要求。针对贯通式液冷模块中同型号芯片均温性的要求,以总热耗为200 W的贯通式液冷模块为例,给出了贯通式液冷模块内部均温性的方案、技术途径与测试验证方案。通过试验表明,在贯通式液冷模块上实施均温性方案,可将同型号发热芯片的温差控制在较低的范围,可以满足电子设备中对贯通式液冷模块均温性的要求。

With the rapid development of microelectronic technology,the thermal power consumption and flux of the chip become larger and larger.In some application scenarios,the same liquid flow through module has very strict requirements on the average temperature of multiple chips of the same type.In order to meet the requirement of the same type of chip temperature uniformity in the liquid flow through module,this paper gives the scheme,technical approach and test verification scheme of the liquid flow through module of 200W as an example.The test results show that the temperature difference of the same type heating chip can be controlled in a lower range by implementing the temperature uniformity scheme in liquid flow through module.