摘要
微细通道换热器在电子器件水冷散热领域有着广阔的应用前景,然而传统微细通道换热器采用钎焊工艺,焊接过程中所使用的钎料容易堵塞通道,本文采用扩散焊工艺制造了一款具有良好强度和完整性的微细通道换热器,不需要采用任何钎料。通过实验研究了该微细通道换热器的传热和阻力特性,分析了变工况条件下相关性能参数的变化趋势,最后获得了可以用于指导微细通道换热器设计的传热和阻力实验关联式。
The mini-channel heat exchanger has broad application prospects in the field of electronic cooling.But the traditional mini-channel heat exchanger is welded by diffusion bonding technology,in which the brazing filler metals may block the mini-channels.In this paper,a mini-channel heat exchanger with good strength and integrity was manufactured by the diffusion bonding technology without any brazing filler metals.Experimental study was performed on the heat transfer and pressure drop characteristics of this mini-channel heat exchanger.The variation trends of related parameters were analyzed under variable working conditions.Finally,the heat transfer and pressure drop correlations that can be used to guide the design of PCHEs were obtained.
作者
王宇阳
郝军凯
杨尚升
刘威
冯元
Wang Yuyang;Hao Junkai;Yang Shangsheng;Liu Wei;Feng Yuan(Nuclear Power Institute of China,Chengdu 610213,China)
出处
《广东化工》
CAS
2022年第13期75-77,43,共4页
Guangdong Chemical Industry
关键词
微细通道换热器
传热
阻力
扩散焊
电子器件散热
mini-channel heat exchanger
heat transfer
pressure drop
diffusion bonding
electronic cooling