一种高可靠性金属镀层FR-4导电复合材料的制备

Preparation of FR-4 Conductive Composite with High Reliability Metal Coating

5G通讯技术对基站的可靠性要求越来越高。本文选用玻璃布基板(FR-4)基材作为印制电路(PCB)基底,通过简单高效的化学镀技术在其表面沉积金属,得到具有高可靠性金属镀层的FR-4导电复合材料。在本研究中,将3-氨基丙基三乙氧基硅烷偶联剂(KH550)和3-(2,3-环氧丙氧)丙基甲基二甲氧基硅烷偶联剂(KH562)引入氯金酸溶液中,制备了金纳米颗粒/聚合物刷(AuNPs/PB)催化溶液。KH562中的环氧基经开环反应与KH550中的氨基形成仲氨基和羟基,通过螯合作用吸附AuNPs,从而在FR-4基材表面建立较高结合强度的催化层。此外,还研究了KH562浓度对金属层结合力的影响,结果表明:当KH562浓度为10%时,AuNPs的吸附效果最好。以生成的AuNPs/PB为催化中心,通过化学镀技术可以在其表面沉积金属层得到高可靠性的导电复合材料。

The requirements for the reliability of base stations are getting increasingly higher in 5 G communication technology. In this paper, FR-4(glass cloth substrate) substrate is selected as the printed circuit(PCB) substrate, and metal is deposited on its surface through simple and efficient electroless plating technology to obtain FR-4 conductive composite material with high-reliability metal coating. In this study, 3-aminopropyltriethoxysilane coupling agent(KH550) and 3-(2,3-epoxypropoxy) propylmethyldimethoxysilane coupling agent(KH562) were introduced into the chloroauric acid solution, and then the gold nanoparticle/polymer brush(AuNPs/PB) catalytic solution was prepared. Through a ring-opening reaction, the epoxy group in KH562 forms a secondary amino group and a hydroxyl group with the amino group in KH550, and the AuNPs are adsorbed by chelation, thereby establishing a catalytic layer with higher bonding strength on the surface of the FR-4 substrate. In addition, the influence of the concentration of KH562 on the binding force of the metal layer was also studied, and the results showed that when the concentration of KH562 was 10%, the adsorption effect of AuNPs was the best. With the generated AuNPs/PB as the catalytic center, a highly reliable conductive composite material can be obtained by depositing a metal layer on its surface through electroless plating technology.