阳离子固化环氧固晶胶在LED小芯片封装中的应用

Application of Cationic Polymerization of Epoxy Resins in LED Packaged with Small Size Chips

采用差示扫描量热法(DSC)对环氧树脂ERL-4221阳离子聚合固晶胶的反应动力学进行研究,并利用Kissinger模型对非等温数据进行分析。在阳离子固化剂质量分数为1.0%的条件下,该环氧固化体系的表观活化能为81.76 kJ/mol,表明该反应体系在常温下反应速度较慢,具有明显的潜伏特性。利用T-β外推法及等温固化过程确定了体系固化烘烤工艺为105℃(30 min)+170℃(30 min)。同时,采用芯片剪切力测试及分层试验证实了工艺参数的有效性。研究结果可为该固晶胶固化工艺及应用提供理论支撑。

The reaction kinetics of cationic polymerization of epoxy resins(ERl-4221)was investigated by differential scanning calorimetry(DSC).The model-fitting Kissinger was applied to the analysis of non-isothermal data,and the apparent activation energy with the cationic curing agent mass fraction of 1.0%is 81.76 kJ/mol.The results show that the cationic polymerization of epoxy resins is a deferred reaction at room temperature with obvious latent features.The curing parameters was obtained by adopting“T-β”extrapolation,and the die shear test and C-SAM test prove the validity of the curing parameters designed in this paper.These results constitute a theoretical basis for the curing and application of the die attach adhesive.