一种DSCPDFN双面冷却封装结构

A Dual-Side Cooling PDFN Package Structure

传统封装结构以引脚或者底部外露散热片为途径,将热量从芯片运送到PCB板,保证芯片正常运转,这种方式一般称之为单面散热。随着半导体器件高功率密度越来越大,对器件的工作环境和封装的散热能力提出了严苛的要求。因此,多面散热的结构受到广泛关注。多面散热一般指的是除了固有的PCB散热面,在其他的面也有高效的导热通道,达到热交换目的以降低芯片工作温度。在传统封装产品系列中,四侧无引脚扁平封装(QFN)封装由于其良好的散热特性以及电学特性深受功率器件市场的青睐,但是面对越来越高的功率密度带来的热管理问题,其局限性也越来越突出。因此,本文提出了一种双面散热QFN封装结构,并采用有限元仿真分析方法,对比了该结构与传统QFN封装在电和热方面差异,得出结论:该结构提升了QFN结构的电和热管理能力。

The traditional package structure takes the pin or exposed heat sink at the bottom as the way to transport the heat from the chip to the PCB board to ensure the normal operation of the chip.This method is generally called single-sided cooling.With the increasing high power density of semiconductor devices,strict requirements are put forward for the working environment of devices and the heat dissipation capacity of package.Therefore,the structure of multi-faceted heat dissipation has attracted extensive attention.Multi sided heat dissipation generally refers to that in addition to the inherent PCB heat dissipation surface,there are also efficient heat conduction channels on other surfaces to achieve the purpose of heat exchange and reduce the working temperature of the chip.In the traditional assembly package product series,QFN package is favored by the power device market because of its good heat dissipation characteristics and electrical characteristics.However,facing the thermal management problems caused by higher and higher power density,its limitations are becoming more and more prominent.Therefore,this paper proposes a dual-sided cooling QFN package structure,and uses the finite element simulation analysis method to compare the electrical and thermal differences between this structure and the traditional QFN package.It is concluded that this structure can improve the electrical and thermal management ability of QFN structure.