低介电聚酰亚胺复合片材的结构设计与性能研究

Structural Design and Performance Research of Low-Dielectric Polyimide Composite Sheet

基于夹层结构设计,在聚酰亚胺(PI)薄膜夹层间引入多孔聚酰亚胺泡沫(PIF),成功制备具有低介电常数的PI复合片材,并研究PIF厚度对复合片材介电性能、力学性能和导热性能的影响。结果表明:介电常数随着PIF厚度的增加而增加,厚度为1 mm的复合片材的介电性能最佳,100 Hz下介电常数低至1.55。随着PIF厚度的增加,复合片材的拉伸强度降低,导热系数先降低后趋于平缓。FFF-15-5样品的导热系数最低为0.046 W/(m·K),复合片材显示良好的隔热性能。该PI复合片材为低介电材料的设计提供新思路。

Based on sandwich structure design, porous polyimide foam(PIF) was introduced to polyimide(PI) film sandwiches, and the PI composite sheet with low dielectric constant was successfully prepared. The influence of PIF thickness on the dielectric properties, mechanical properties and thermal conductivity of the composite sheet was studied.The results show that the dielectric constant increases with the increasing of PIF thickness. The composite sheet with thickness of 1 mm has the best dielectric property, and the dielectric constant is as low as 1.55 at 100 Hz. With the increasing of PIF thickness, the tensile strength of the composite sheet decreases, and the thermal conductivity decreases first and then tends to be gentle. The lowest thermal conductivity of FFF-15-5 sample is 0.046 W/(m·K), and the composite sheet shows good thermal insulation. The PI composite sheet provides a new idea for the design of low dielectric materials.