环冷机回转框架轻量化研究

Lightweight study of rotary frame of ring cooler

针对环冷机制造成本、运行功耗高等问题,本文对环冷机中的关键部件回转框架进行轻量化研究,通过建模软件和仿真分析软件对其关键部位的应力和回转框架体位移量进行仿真优化,并确定相关加工工艺优化措施。结果表明:回转框架减薄后比减薄前应力会有一定范围的小幅度提升(0~20 MPa),但远在应力安全许可范围内;回转框架的位移变形量为4 mm,其内外环的相对转动角度很小,也远在安全距离内。改进后的环冷机回转框架,可以降低生产原料成本约14%。

Aiming at such problems as high manufacturing cost and operating power consumption of the ring cooler, a lightweight study of rotary frame in the key component of ring cooler is conducted.Through the modeling software and simulation analysis software, the stress and the displacement of the rotary frame in the key parts are simulated and optimized, and the relevant process optimization measures are determined.The results show that there is a small increase in stress(0~20 MPa)after thinning the rotary frame compared to the stress before thinning, but it is well within the safe range of stress;the displacement deflection of the rotary frame is 4 mm and the relative rotation angle of its inner and outer rings is very small and also well within the safe distance.The improved rotary frame of the ring cooler can reduce the cost of raw materials for production by about 14%.