厚度与粗糙度对紫铜镀银层温升的影响

Influence of Thickness and Roughness on Temperature Rise of Silver Plat‐ed Pure Copper Materials

本文对粗糙度为1.6μm紫铜材质试样进行不同厚度的镀银处理,并详细测试其银层粗糙度、厚度、结合力与导电性能。结果表明:镀银厚度越小,银层性能越优。设计银层厚度为12~18μm之间,电导率为93.8~94.7 IACS,温升65 K±0.21 K~65 K±0.41 K,满足设计要求;设计银层厚度为30~50μm之间,电导率为89.3~91.7 IACS,温升66 K±0.40 K~67 K±0.47 K,超过设计要求。

The pure copper parts with 1.6μm roughness were treated with different silver thickness,and the roughness,thickness,and adhesion of the silver layer were tested.The results showed that the smaller the thickness of silver plating was,the better the performance of silver coating would be.When the designed thickness of silver layer ranges from 12 to 18μm,the average conductivity of silver layer is 93.8 IACS to 94.7 IACS,and the temperature rise is 65 K±0.21 K to 65 K±0.41 K,meeting design requirement.When the designed thickness of silver layer ranges from 30 to 50μm,the average conduc‐tivity of silver layer reaches 89.3 IACS to 91.7 IACS,and the temperature rise is 66 K±0.40 K to 67 K±0.47 K,exceeding design requirements.