一种水冷系统建模及IGCT结温计算方法

A Water Cooling System Modeling and IGCT Junction Temperature Calculation Method

提出一种双面水冷散热器等效热阻参数提取方法,在此基础上进行水冷散热系统建模,进而实现对IGCT等功率器件结温的实时计算和保护。由热设计软件仿真或实验结果得到的散热功率和温升数据计算出散热器正反两面的直接热阻和耦合热阻。将水冷散热器直接热阻、耦合热阻、功率器件功耗、功率器件内部热阻参数代入水冷散热系统模型,可对各个功率器件的功耗及温升实时独立计算。该方法考虑了水冷散热器多级串联压接应用中功率器件发热功率实时变化以及水冷散热器热耦合效应的影响,可以更加精确地估计出功率器件的结温。

A method to extract the equivalent thermal resistance parameters of double-sided water-cooled heatsink was proposed.Based on this method,the real-time calculation of junction temperature and overtemperature protection of integrated gate commutation transistor(IGCT)power device were implemented by the water-cooled cooling system.The direct thermal resistance and coupling thermal resistance of the front and back sides of the heatsink were calculated based on the data of heat dissipation power and temperature rise obtained from the simulation or experiment results of the thermal design software.The direct thermal resistance,coupling thermal resistance,power device power consumption and internal thermal resistance of water-cooled heat sink were substituted into the model of water-cooled cooling system,and the power consumption and temperature rise of each power device could be calculated independently in real time.This method takes into account the real-time variation of the heating power of the power device and the thermal coupling effect of the water-cooled heatsink in the application of multi-stage series pressing system,can accurately estimate the junction temperature of power device.