固体线阵电子模块热工况试验研究

An Experimental Research of the Thermal Condition of Electronic Modules in Solid Linear Array

为解决固体拖线阵中电子模块散热困难,易发生过热失效的问题,对相关电子模块在固体填充介质中的热工况进行了模拟仿真和试验研究。针对热功率最大、散热问题最突出的粗阵传输节点模块,建立其热力学模型,利用有限元分析法对其热工况进行了仿真分析;采用热敏电阻与红外成像仪对传输节点模块、电源模块、航向传感器在不同工况下的散热情况进行了对比测试和分析。结果表明,固体填充介质流动性差、导热系数低是导致固体阵电子模块散热困难的主要原因。据此,提出了导热胶与散热骨架结合优化电子模块散热的方案,并对其效果进行了试验验证。经对比测试,采用该方案可以使粗阵传输节点模块的最高温度由100℃以上降低至75℃以下,保证其长时间稳定工作;其他类型电子模块温度也控制在允许的安全工作温度范围之内。

In order to solve the problems that electronic modules in the solid towed linear array were difficult to dissipate heat and easy to overheat and lose efficacy,analog simulation and experimental research were carried out on the thermal conditions of related electronic modules in solid filling media.Aiming at a coarse array transmission node module with the largest thermal power and the most outstanding heat dissipation problem,establishing a thermodynamic model of the coarse array transmission node module,and performing simulation analysis on the thermal condition of the coarse array transmission node module by using a finite element analysis method;the thermistor and the infrared imager were adopted to carry out comparative test and analysis on the heat dissipation performance of the transmission node module,the power supply module and the course sensor under different working conditions.The results show that the poor flowability and low thermal conductivity of the solid filling medium are main reasons for difficulty in heat dissipation of electronic module in the solid linear array.Therefore,the scheme that the heat-conducting glue and the heat-radiating framework are combined to optimize the heat dissipation performance of the electronic modules is provided,and the effect of the scheme is tested and verified.Through comparative tests,the maximum temperature of the coarse array transmission node module can be reduced from more than 100℃ to less than 75℃ by adopting the scheme,and the long-time stable work of the coarse array transmission node module is ensured.The temperature of other types of electronic modules is also controlled within the allowable safe operating temperature range.