某电子设备热结构设计

Thermal and Structure Design of an Electronic Equipment

某型电子设备要求轻量化、体积小、安装方便与散热满足使用要求。根据设备结构内部器件布局、功耗与热点分布,综合考虑了结构刚度、强度与散热要求,设计了一种多散热齿散热的薄壁结构方案,散热方式采用风机强迫风冷与自然散热相结合的方式。在设备进行全功率运行时即产热量最高时,进行了热传导、散热、风量与风压边界条件计算,根据计算结果与风量需求选择了风机型号。风机选定后,用FloEFD软件对设备工作状态进行热仿真。仿真结果显示,当外界温度为40℃,设备在全功率工作,热交换达到稳定状态时,主要工作器件最高温度为72℃,低于工作极限温度的75℃,设备能够正常工作。产品加工装配完成后,整机尺寸为600 mm×500 mm×245 mm,质量为19 kg,通过环境与筛选实验验证,设备结构设计与散热设计能够满足使用要求。

The electronic equipment of a certain requires light weight,small volume,convenient installation and heat dissipation to meet the use requirements.According to the equipment structure layout,internal device power consumption and hot spot distribution,and comprehensively considering the structural stiffness,strength and heat dissipation requirements,a thin walled structure scheme with multiple heat dissipation teeth was designed.The heat dissipation mode adopted the combination of fan forced air cooling and natural heat dissipation.When the equipment was in full power operation,that was when the heat production was the highest,the boundary conditions of heat conduction,heat dissipation,air volume and air pressure were calculated,and the fan model was selected according to the calculation results and volume demand.After the fan was selected,the equipment working state was thermally with FloEFD software.The simulation results show that when the external temperature is 40℃,the equipment works at full power and the heat exchange reaches a stable state,the maximum temperature of the device is 72℃,which is 75℃ lower than the working limit temperature,the equipment can work normally.After the processing and assembly of the product,the overall size is 600 mm×500 mm×245 mm and the weight is 19 kg.Through the verification of environmental and screening experiments,the equipment structure design and heat dissipation design can meet the use requirements.