香菇菌棒包装袋撑圆装置关键技术研究

Key Technology of Round Supporting Device for Lentinus Edodes Stick Packaging Bag

目的为了提高香菇包装机的包装效率,提升包装机的整体性能。方法首先分析研究包装袋基本参数、拉伸特性、人工套袋方式,通过类比人工套袋得到撑圆装置设计方案。基于此方案,对撑圆装置的关键结构尺寸参数进行详细设计。结果建立了三维模型并导入Ansys进行静力学分析,得到了撑圆装置的应力分布云图。撑圆机构动作过程中受到的最大压应力为2.48 MPa,远小于树脂材料弯曲强度67 MPa;最大变形量为0.175 mm,出现在撑圆机构最前端,不影响后序动作。结论文中证明了撑圆装置结构设计的合理性和模型建立的准确性,为同类型结构的设计提供一定的理论参考。

The work aims to improve the packaging efficiency of the lentinus edodes packaging machine and improve the overall performance of the packaging machine.First,basic parameters,stretching characteristics and manual packag-ing methods of the packaging bag were analyzed and studied.The design scheme of the round supporting device was ob-tained by analogy with manual packaging.Based on this scheme,the key structural dimension parameters of the round supporting device were designed in detail.The 3D model was established and imported into ANSYS for static analysis to get the force distribution pattern.The results showed that the maximum pressure stress of the round supporting mechanism during action was 2.48 MPa,which was much smaller than the bending strength of resin 67 MPa.The maximum strain was 0.175 mm,which happened at the front end of the round supporting mechanism.It did not affect the post sequence action.The design rationality of the round supporting device and the accuracy of model established are proved.It provides a certain theoretical reference for design of similar structures.