电镀含铜废水处理技术研究进展

Research progress of copper electroplating wastewater treatment technology

随着电子电镀行业的快速发展,涉及镀铜表面处理过程不断增多,会产生大量电镀含铜废水,若将其直接排放会对生物和环境产生巨大危害,同时也是对铜资源的浪费,因此,如何对电镀含铜废水进行合理、有效地处置日益引起人们的关注。本文主要从化学法、物化法以及生物法3个方面对电镀含铜废水的研究现状及处理技术进行综述,着重阐述沉淀法、膜分离、吸附法以及其他技术的处理工艺及实际效果,结合实例对具体处理方法的基本原理、优缺点和适用面进行对比分析;针对目前处理技术的不足,讨论未来电镀含铜废水处理技术的发展方向,同时对其资源化利用进行展望和总结,以便为电镀含铜废水的高效处理及资源化利用提供参考。

With the rapid development of the electronic electroplating industry,the surface treatment processes involved in copper plating continue to increase,and a large amount of copper-containing wastewater will be generated.If it is directly discharged,it will cause great harm to organisms and the environment,and it is also a waste of copper resources.The reasonable and effective treatment of electroplating copper-containing wastewater has attracted increasing attention.This article mainly summarizes the research status and treatment technology of electroplating copper-containing wastewater from three aspects,i.e.chemical method,physicochemical method and biological method.It focuses on the treatment process and actual effect of precipitation method,membrane separation,adsorption method and other technologies.The examples were used to compare and analyzes the basic principles,advantages and disadvantages and application of specific treatment methods,and the future development direction of electroplating copper-containing wastewater treatment technology was discussed in view of the shortcomings of the current treatment technology,and a brief outlook on its resource utilization was given.In summary,it provides a reference for the efficient treatment and resource utilization of copper-containing electroplating wastewater.