成型烧结过程对钽阳极电性能的影响

Influence of Molding and Sintering Process on Electrical Property of Tantalum Anode

以牌号FTA500钽粉为代表.选择容量为50000μF·V/g的钽粉.探索了成型过程和烧结过程对钽阳极漏电流、容量等电性能参数的影响。研究表明:随着成型压制密度逐渐增大时,钽阳极块的开孔率减小、容量降低,当成型压制密度为5.00g/cm^(3)时,阳极块漏电流系数为最低;随着烧结温度的提高,钽阳极烧结密度增大、容量下降、漏电流系数降低,同时钽阳极损耗增大,体积收缩率增大,击穿电压升高。

The FTA500 grade tantalum powder with the capacity of 50 000 μF·V/g is chosen to explore the effect of the molding and sintering processes on electrical properties of tantalum anode. The results show that the opening ratio and capacity of tantalum anode block decrease with the increase of pressing density. When the pressing density is 5.00 g/cm^(3), the leakage current coefficient of anode block is the lowest. With the increase of sintering temperature, the sintering density increases, the specific capacitance and the leakage current coefficient decrease, the loss of tantalum anode increases, the volume shrinkage increases, and the breakdown voltage increases.