Cu、Sn对铝硅镀层热冲压成形性能的影响

Effect of Cu and Sn on Hot Stamping Formability of Aluminum Silicon Coating

常规的铝硅镀层产品在热冲压过程易形成裂纹,成形性能较差。通过在铝硅镀层中添加Cu、Sn,研究不同Cu、Sn含量对铝硅镀层热冲压成形性能的影响。通过热浸镀模拟试验机制取不同Cu、Sn含量的铝硅镀层钢板试样,使用电感耦合等离子体光谱仪、扫描电子显微镜、能谱分析仪研究不同Cu、Sn含量铝硅镀层钢板试样的镀层组织结构。使用箱式电阻加热炉及U型冲压机进行热冲压成形,使用扫描电子显微镜、能谱分析仪、辉光光谱仪研究了U型件铝硅镀层裂纹扩展情况。结果表明:当铝硅镀层中添加一定量的Cu时,镀层中会形成少量富Cu相,添加一定量的Sn可使组织更细小、均匀;加热后铝硅铜镀层硬度增大,恶化其热冲压成形性能;但添加一定量的Sn可改善铝硅镀层热冲压成形性能。

The conventional aluminum-silicon coating products are easy to form cracks and have poor formability during hot stamping. The influence of different Cu and Sn contents on the hot stamping properties of aluminum silicon coating was studied by adding Cu and Sn to the aluminum silicon coating. Samples of aluminum silicon coating steel plates with different Cu and Sn contents were obtained by hot-dip simulation test machine. The coating structure of aluminum silicon coated steel samples with different Cu and Sn contents was studied by means of inductively coupled plasma spectrometer, scanning electron microscope and energy spectrum analyzer. Hot stamping was carried out by means of resistance heating furnace and U type stamping machine. The crack propagation of aluminum-silicon coating was studied by scanning electron microscope,energy spectrum analyzer and glow spectrometer. The results show that when a certain amount of Cu is added to the aluminum-silicon coating, a small amount of Cu-rich phase is formed in the coating, and a certain amount of added Sn makes the structure smaller and more uniform;the hardness of the Al-Si-Cu coating increases after heating and the formability of the coating are deteriorated. But the addition of a certain amount of Sn can improve the hot stamping formability of the aluminum silicon coating.