摘要
电子信息技术的发展对覆铜板(CCL)提出了更高的性能要求。无机填料在CCL中的应用越来越广泛,地位越来越突出,和树脂、铜箔、玻璃纤维布一起被称为CCL生产制造中的四大主要原材料。文章结合相关论文、专利论述硅微粉无机填料在CCL中的应用现状和发展趋势。
The development of electronic information technology has put forward higher performance requirements for CCL.Inorganic fillers are more and more widely used in CCL,and their status is becoming more and more prominent.Together with resin,copper foil and glass fiber cloth,they are called the four main raw materials in CCL manufacturing.This paper discusses the application status and development trend of silica micro powder inorganic filler in CCL based on relevant papers and patents.
出处
《印制电路信息》
2022年第8期29-32,共4页
Printed Circuit Information
关键词
覆铜板
无机填料
硅微粉
二氧化硅
CCL
Inorganic Filler
Silicon Micro Powder
Silica
