基于电磁屏蔽之挠性印制板差分阻抗关键因素探究

Research on the key factors of differential impedance of flexibleprinted board based on electromagnetic shielding

为了避免印制电路板上信号传输过程受到电磁干扰,在挠性板上往往会设计一层电磁屏蔽膜用于抗电磁干扰。此时电磁屏蔽膜会影响传输线的阻抗。文章通过测试不同的阻抗参考平面,在满足传输线匹配的前提下,增大传输线宽度,保证产品的可靠性及生产良率,以供相关技术人员做参考。

In order to avoid the electromagnetic interference during signal transmission on PCB,people usually design a layer of electromagnetic shielding film on the flexible plate.The electromagnetic shielding film will affect the impedance of the transmission line.In this paper,by testing different impedance reference planes,and based on the premise of satisfying the matching of transmission lines,the width of transmission lines is increased to ensure the reliability of products and production yield,so as to provide reference for relevant technical personnel.