摘要
在提高机载雷达电子设备的散热可靠性、保证设备稳定可靠运行方面,电子设备的热仿真分析十分关键。机载机箱结构复杂,插件较多,因此若直接进行详细建模计算,则网格数量大,计算时间长,计算效率低。文中采用Icepak软件的Zoom-in功能对机箱分别进行了系统级及板级的仿真模拟分析,得出了机箱整体温度场、流场以及关键元件的温度分布。同时还利用该方法研究了机箱插件在不同飞行高度下的温度特征。该方法提高了仿真计算效率,为机箱插件布局及散热优化设计提供了新思路。
The thermal simulation analysis of the chassis is very important to improve the heat dissipation reliability of airborne radar electronic equipment and ensure the stable and reliable operation of the equipment.Detailed simulation calculation of the airborne chassis with complex structure and many plug-ins means a large number of grids,which can result in waste of computing time and resources.In this paper the system level and board level simulations of the chassis are carried out using Zoom-in function of Icepak software respectively.The overall temperature field,flow field and temperature distribution of key components of the chassis are obtained.At the same time,the temperature characteristics at different flight altitudes are studied with this method.This method can improve the simulation calculation efficiency and provide a new idea for optimal design of chassis heat dissipation.
作者
董雅洁
叶锐
DONG Yajie;YE Rui(The 38th Research Institute of CETC,Hefei 230088,China)
出处
《电子机械工程》
2022年第4期44-47,共4页
Electro-Mechanical Engineering
关键词
机箱
系统级
板级
仿真分析
chassis
system level
board level
simulation analysis
