基于TSV倒装焊与芯片叠层的高密度组装及封装技术

High Density Assembly and Packaging Technology Based on Flip-Chip on TSV and Chip Stacking

系统级封装(Si P)及微系统技术能够在有限空间内实现更高密度、更多功能集成,是满足宇航、武器装备等高端领域电子器件小型化、高性能、高可靠需求的关键技术。重点阐述了基于硅通孔(TSV)转接板的倒装焊立体组装及其过程质量控制、基于键合工艺的芯片叠层、基于倒装焊的双通道散热封装等高密度模块涉及的组装及封装技术,同时对利用TSV转接板实现多芯片倒装焊的模组化、一体化集成方案进行了研究。基于以上技术实现了信息处理Si P模块的高密度、气密性封装,以及满足多倒装芯片散热与CMOS图像传感器(CIS)采光需求的双面三腔体微系统模块封装。

System in package(SiP)and microsystem technologies can achieve higher density and more functional integration in limited space,and they are the key technologies to meet the requirements of miniaturization,high performance and high reliability of electronic devices in high-end fields such as aerospace,weapons and equipment.The assembly and packaging technology of high density modules,such as reverse welding three-dimensional assembly and process quality control based on through silicon via(TSV)interposer,chip lamination based on bonding process,double channel heat dissipation package based on reverse welding,are discussed.Meanwhile,the modular and integrated scheme of multi-flip-chip using TSV interposer is studied.Based on the above technologies,the high density and air tight packaging of information processing SiP module and the double-sided three-chamber microsystem module packaging,which meet the requirements of heat dissipation of multi-flip-chip and daylighting of CMOS image sensor(CIS),are realized.