感应等离子制备喷涂靶材用球化钽粉工艺研究

Study on the Process of Spheroidized Tantalum Powder for Sputtering Target by Inductive Plasma Process

采用感应等离子技术对喷涂靶材用钽粉进行球化处理,以不规则冶金级钽粉为实验原料,研究了等离子气体流量、等离子功率、载气流量和送粉速率对钽粉球化率的影响。使用扫描电子显微镜(SEM)对粉末形貌进行表征,并采用Image J软件图像处理与分析方法进行粉末球化率测试。结果表明,感应等离子工艺参数的变化可以显著改变粉体球化率,当使用气体流量适当增加、等离子功率增加、载气流量适当降低、送粉速率降低时有利于粉末化率的提高,当优选的球化工艺为氢气流量PG3、等离子功率15 kW、载气流量CG3、送粉速率FR2时,可得到高品质球形钽粉。

Tantalum powders for sputtering targets were spheroidized by inductive plasma technology.Using irregular metallurgical powders as raw materials,the influence of plasma gas flow rate,plasma power,carrier gas flow rate and powder feeding rate on the sphero level of the tantalum powders was particularly analyzed.The powder morphology was characterized via Hitachi SU5000 Scanning Electron Microscope(SEM),and the powder spheroidization rate was tested by Image J software image processing and analysis method.The results indicated that the induction plasma process parameters can significantly affect the sphero level of the powders.When the gas flow rate or the plasma power was appropriately increased,the carrier gas flow rate or the powder feeding rate was decreased,it was conducive to the improvement of the spheroidization.By using hydrogen flow PG3,plasma power 15 kW,carrier gas flow CG3 and powder feeding rate FR2,high quality spherical tantalum powders were obtained in this study.