印制板组件中氯离子腐蚀失效案例分析

Analysis of the Failure Cases of Chloride Ion Corrosion in PCBA

在印制板组件众多的失效中,氯离子所引发的腐蚀、电迁移等是最为常见的失效模式。深度剖析了两个由氯离子引起电路板失效的典型案例,阐述了案例背景、分析过程、失效原因和失效机理,并提出了实际可行的解决方法与改善建议,对提高产品可靠性有一定的参考价值。

Corrosion and electromigration caused by chloride ions are the most common failure modes among many failure of PCBA.Two typical cases of circuit board failure caused by chloride ions are deeply analyzed,and the case background,analysis process,failure cause and failure mechanism are expounded,and practical solutions and improvement suggestions are proposed,which has certain reference value for improving the reliability of products.