摘要
扇出型BGA封装已逐渐地成为高密度、高性能集成电路的主要封装技术。以扇出型BGA封装器件为研究对象,通过ANSYS软件建立有限元仿真模型,评估板级温度循环试验中,不同的塑封厚度下扇出型器件的焊球互联结构可靠性,预测焊球的温循疲劳寿命。根据仿真结果来确定器件的封装设计,完成了相应的温度循环试验,对于提高扇出型BGA封装的焊球疲劳寿命具有一定的指导意义。
Fan-out BGA packaging has gradually become the main packaging technology for high-density,high-performance integrated circuits.Taking the fan-out BGA package device as the research object,the finite element simulation model is established by ANSYS software to evaluate the reliability of the solder ball interconnection structure of the fan-out device under different plastic package thickness in the board-level temperature cycle test and predict the thermal cycle fatigue life of the solder balls.According to the simulation results,the package design of the device is determined,and the corresponding temperature cycle test is completed,which has certain guiding significance for improving the fatigue life of the fan-out BGA package solder balls.
作者
王剑峰
袁渊
朱媛
张振越
WANG Jianfeng;YUAN Yuan;ZHU Yuan;ZHANG Zhenyue(The 58th Research Institute of CETC,Wuxi 214035,China)
出处
《电子产品可靠性与环境试验》
2022年第4期75-80,共6页
Electronic Product Reliability and Environmental Testing
