摘要
随着5G通信时代的到来,人们对信号传输速率及信号完整性有了更高的要求。对于多层PCB板,过孔的使用会对高速信号传输及阻抗匹配有很大的影响。基于85ohm特征阻抗,以Rogers 4350b为基板设计了一款14层高速PCB板,利用ANSYS电磁仿真软件对过孔的阻抗进行仿真分析。通过仿真结果分析得到采用背钻并优化anti-pad的方式能很好地改善过孔的阻抗。
With the advent of the 5G communication era,people have higher requirements on signal transmission rate and signal integrity.For multi-layer PCB,the use of through hole will have a great impact on high-speed signal transmission and impedance matching.Based on the 85ohm characteristic impedance,this paper designs a 14-layer high-speed PCB board based on Rogers 4350b,and ANSYS electromagnetic simulation software is used to simulate the impedance of the through hole.The simulation results show that the back drill and anti-pad optimization can improve the impedance of the through hole.
出处
《工业控制计算机》
2022年第8期157-158,共2页
Industrial Control Computer
关键词
PCB
通孔
背钻
阻抗匹配
PCB
through hole
back drill
impedance match
