Flexible substrates enabled highly integrated patterns with submicron precision toward intrinsically stretchable circuits

Fabricating high integration density,high resolution,and intrinsically stretchable patterns by patterned technologies remain challenging.Template printing enabled high-precision patterned fabrication at a facile operation.However,the pattern spacing constraint is the major limitation to high integration density.In this study,we develop an elastomer-assisted strategy to improve the template printing process,which involves patterning on the prestrain elastic substrate.This strategy overcomes the spacing limitation and enables the realization of a centimeter-scale pattern with submicron precision.Particularly,the integration density of fabricated intrinsically stretchable patterns can reach 1932 lines on a substrate of 0.5 cm2;the assembly lines with a feature size of 880 nm and an interval of 955 nm.Furthermore,we demonstrate a facile approach for constructing silver nanoparticle/liquid metal alloy composite conductive patterns.The as-prepared flexible electrodes can withstand up to 150%strain and a 2-mm bend radius.This method provides new insights into template printing technology.Additionally,it opens a route for the simultaneous construction of functional patterned arrays with large scale,high integration density,and intrinsic stretchability,which will be useful for the integrated fabrication of various flexible electronic devices.