太阳能硅片清洗剂的研究与配方设计

Research and Formulation Design of Cleaning Agent for Solar Silicon Wafer

太阳能硅片在金刚线切割和打磨过程中会受到严重沾污,需要采用物理或化学方法去除其表面的污染物,以符合洁净度和表面状态的要求。为了减少对硅片的过度腐蚀以及保持硅片清洗工作液的持久性,通过正交试验,确定了表面活性剂A组分和碱剂B组分的最佳配比。表面活性剂A组分的最佳配比为:乙二胺二邻苯基乙酸钠、PO嵌段FMEE、FMES、伯烷基磺酸钠(PAS)和烷基糖苷(APG)的质量比为7:8:3:5:3。碱剂B组分的最佳配比为:氢氧化钾、氢氧化钠、偏硅酸钠和碳酸钠的质量比为3:1:2:2。以A组分和B组分组成的硅片清洗剂环保、无磷、碱性适中,清洗时间短,对硅粉和金属氧化膜去除效果好,洗后的硅片表面光滑无凹坑、线痕等现象。

Solar silicon wafers will be seriously contaminated during the diamond wire cutting and grinding process,and physical or chemical methods need to be used to remove the contamination on their surface to meet the requirements of cleanliness and surface condition.In order to reduce the excessive corrosion of silicon wafers and maintain the durability of cleaning working fluid,the optimal ratio of surfactant A component and alkaline agent B component was determined through orthogonal tests.The optimal ratio of surfactant A component is:the mass ratio of sodium ethylenediamine di-o-phenylacetate,PO block FMEE,FMES,PAS and APG is 7:8:3:5:3.The optimal ratio of alkali agent B component is:the mass ratio of potassium hydroxide,sodium hydroxide,sodium metasilicate and sodium carbonate is 3:1:2:2.The silicon wafer cleaning agent composed of components A and B is environmentally friendly,phosphorus-free,moderately alkaline,and has a short cleaning time.It has a good removal effect on silicon powder and metal oxide film,and the surface of the silicon wafer after washing is smooth without pits,line marks and other phenomena.