全串联高功率密度紫外LED结构和散热研究

Study on the Structure and Heat Dissipation of Full Series High Power-density Ultraviolet LED Module

提高紫外LED光源模块的功率密度和辐照度已成为光固化应用的迫切需求。本文设计制作了一种6颗芯片串联的高功率密度UV-LED光源模块,加装了循环水冷散热器对其进行有效散热。通过仿真和实验对该模块的各项参数进行测试,证实仿真模型的预测能力。实验结果表明,全串联光源模块输入功率最高可以达到325.8 W,功率密度达到646.5 W/cm 2,此时芯片结温能够维持在130℃左右。

Improving the power density and irradiance of UV-LED light source modules has become an urgent demand for photocuring applications.In this paper,a high-power density UV-LED module with six chips in series is designed and fabricated,and a circulating water-cooling radiator is adopted for effective heat dissipation.Through simulaton and experiments,the parameters of this module are tested to verify the prediction ability of the simulation model.The experimental results show that the maximum input power of the full-series UV-LED module can reach 325.8 W,meanwhile the power density is 646.5 W/cm 2 and the minimum junction temperature of the chip can be maintained at about 130℃.