红外探测器芯片表面应力释放技术比较研究

Comparative Research About Three Kinds of Die Surface Stress Release Techniques for Infrared Detector Chips

红外焦平面探测器产品易受特殊工作环境、材料热应力失配影响而出现芯片断裂等失效现象,因此,为确保可靠性,对探测器芯片提出了更为迫切的要求。专利技术是法定的知识产权保护手段,专利所披露的探测器芯片可靠性问题的技术路线和解决方案,更加贴近产品实际问题的解决。文中利用技术专利的研究方法,挖掘出国内外业界对恶劣工作环境中芯片热失配问题的三种技术解决方案。文中深入比较了表面设置应力释放图案技术路线中的应力释放点、应力释放槽和应力释放环,这三种具体专利技术路线实现方式,进一步提出了镀膜增强的新方案,供业界制造红外焦平面探测器芯片时比较选择。

Infrared focal plane detector products are vulnerable to special working environment,material thermal stress mismatch and chip fracture failure phenomenon,therefore,in order to ensure the reliability,the detector chip has more urgent requirements.Patented technology is a statutory means of intellectual property protection,and the technical route and solution to the reliability problem of the detector chip disclosed by the patent are closer to the solution of the actual problem of the product.This paper uses the research method of technology patent to excavate three technical solutions to the problem of thermal mismatch of chips in the domestic and foreign industries.This paper deeply compares the stress release point,stress release groove and stress release ring in the technical route of the surface setting stress release pattern,and three specific patented technical route implementation methods,and further proposes a new implementation method of double-sided etch pattern for the industry to choose when manufacturing infrared focal plane detector chips.