低介电高分子材料的发展现状

Development Status of Low Dielectric Polymer Materials

综述了国内外低介电高分子材料的研究进展,其中,包括氟化聚酰亚胺、氟化环氧树脂、液晶聚合物LCP、复合高分子低介电材料等,对比并分析了低介电高分子材料与传统低介电材料的性能差异,展示了行业对新型低介电材料的性能需求,总结了其在信息通信设备中的应用前景,以及高分子材料低介电改性方法和原理,其中,主要包括降低材料极化率和降低材料单位体积内偶极子数量。介绍了目前低介电改性高分子材料的研究方法,包括聚合接枝含氟材料,引入低介电常数无极填料,与含氟材料共混,对材料进行氟化处理,引入孔隙或者孔隙材料等。最后,通过对比几种主要的低介电高分子材料改性方法的特点,研究了未来低介电改性高分子材料的发展方向及趋势。

This paper summarizes the research progress of low dielectric polymer materials at home and abroad, including fluorinated polyimide, fluorinated epoxy resin, liquid crystal polymer LCP, composite polymer low dielectric materials, compares the performance differences between low dielectric polymer materials and traditional low dielectric materials, and shows the performance requirements of the industry for new low dielectric materials, Its application prospect in information communication equipment is summarized. At the same time, the methods and principles of low dielectric modification of polymer materials are summarized, including reducing the polarizability and the number of dipoles per unit volume. The current research methods of low dielectric modified polymer materials are introduced, including polymerization and grafting of fluorine-containing materials, introduction of low dielectric constant electrodeless fillers, blending with fluorine-containing materials, fluorination of materials, introduction of pores or porous materials, etc. Finally, the advantages of several main modification methods of low dielectric polymer materials are compared, and the development direction and trend of low dielectric modified polymer materials in the future are discussed.