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模块化多电平换流器电热耦合模型研究

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摘要 本文提出了一种基于电热耦合模型的MMC功率损耗和结温的仿真计算方法,根据拟合的特性曲线得到不同状态下功率半导体器件的瞬时通态能耗和开关能耗,同时测量基于模型预测控制的MMC仿真系统中的变量。最后,在MATLAB中建立仿真计算模型,通过计算得到相应功率器件的总损耗和结温。
作者 张鹭 李润秋
出处 《电子技术与软件工程》 2022年第14期84-87,共4页 ELECTRONIC TECHNOLOGY & SOFTWARE ENGINEERING
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