基于信息熵的电路板冷却性能评价指标分析

Evaluation Index Analysis of Cooling Performance for an Printed Circiut Board Based on Shannon Entropy

使用有限元方法对电路板的冷却进行了数值模拟,分析了印制电路板上的元器件布局在强迫对流下的冷却效果,其中主要包括元器件的并排、叉排以及元器件间的纵向和横向间距,得到了该模型下的温度场和速度场。引入信息熵等评价性指标对温度场和速度场进行了量化分析,可以发现:元器件并排的冷却效果优于叉排;较大功率的芯片距离冷却气体入口处越近越好;在元器件之间的纵向间距尽可能大的同时选择一个合适的横向间距。

Based on the finite element method,the cooling of the printed circuit board is numerically simulated,and the cooling effect of the component layout on the circuit board under forced convection is analyzed,including the side-by-side and cross rows of components and the vertical and horizontal spacing between components.The temperature field and velocity field under the model are obtained.Shannon entropy and other evaluation indexes are introduced to quantitatively analyze the temperature field and velocity field.It is found that the cooling effect of side-by-side components is better than that of cross rows,and the closer the high-power chip is to the inlet of cooling gas,the better.The longitudinal spacing between components is as large as possible,and an appropriate transverse spacing is selected at the same time.