摘要
对多层共烧陶瓷封装用零部件制造过程中的孔壁金属化工艺开发了专用工装设备,并介绍了主要结构原理及其工艺技术难点。就设备生产使用过程中的常见缺陷形式进行了记录,分析了其成因和预防要点,为后续工艺提高及判断提供了基础研究。
The customized equipment is developed to realize via metallization during the multilayer Co-fired ceramic packaging parts fabrication.The main structure,principle and process difficulties are presented in this paper.Common defects of via metallization during production are recorded,analyzed and prevented,which provides the basis material for process improvement in the future.
作者
李伟
王元仕
郭婷婷
LI Wei;WANG Yuanshi;GUO Tingting(The 2nd Research Institute of CETC,Taiyuan 030024,China)
出处
《电子工业专用设备》
2022年第3期14-17,共4页
Equipment for Electronic Products Manufacturing
关键词
多层共烧陶瓷技术
孔壁金属化
缺陷分析
Multilayer co-fired ceramic technology
Via metallization
Defects analysis
