框架与芯片粘接中两种涂胶工艺分析与优化

Analysis and Optimization of Two Gluing Processes for Frames and Chips Bonding

红外探测器框架涂胶工艺具有胶粘剂种类多、涂胶精度要求高等特点,难以同时兼顾工艺效率和工艺效果。为了探索较优的涂胶工艺,基于一种框架,对比分析了手工涂胶和丝网印刷两种涂胶工艺对框架芯片粘接工艺效果的影响。结果表明,丝网印刷涂胶和手工涂胶工艺均能满足胶粘剂正常固化、耐受100次温度冲击、电路片四周溢胶均匀的基本要求。当丝印网版为集中穿孔模式时,丝网印刷涂胶工艺下的胶层气泡率小于1%,是手工涂胶工艺的0.09倍。使用不同的胶粘剂时,手工涂胶工艺效果不受胶粘剂的填充物直径变化的影响,而丝网印刷更适合含有小直径填充物的胶粘剂。最后,根据网版设计的迭代数据,提出了漏印面积的经验计算公式,为精确、快速的网版设计提供了支持。

The infrared detector frame gluing process has the characteristics of many types of adhesives and high requirements for gluing accuracy.It is difficult to take into account the process efficiency and process effect at the same time.In order to explore a better gluing process,the effects of two gluing processes,manual gluing and silk printing,on the bonding of frames and chips are compared and analyzed based on the same frame.The results show that both silk printing and manual gluing can meet the basic requirements of adhesive curing,resistance to 100 times of temperature shock test and uniform overflow around the circuit chip.When the screen is in the concentrated punch mode,the void fraction of silk printing in the adhesives between the circuit chip and frame is less than 1%,which is 0.09 times that of manual gluing.When using different adhesives,the effect of the manual gluing process is not affected by the change of the filler diameter of the adhesive,while silk printing is more suitable for adhesives with small diameter fillers.Finally,according to the iterative data of silk printing plates,the empirical calculation formula of missing printing area is proposed,which provides support for accurate and fast screen plate design.