电子封装用低银Sn-0.3Ag-0.7Cu钎料研究进展

Research Progress of Low-Silver Sn-0.3Ag-0.7Cu Solder for Electronic Packaging

随着电子封装无铅化、高集成度需求的不断提升,开发低成本、高性能的无铅封装材料对传统含铅材料进行有效替代已成为全球关注的热点。目前所开发的Sn-Ag-Cu系无铅钎料中含银量最低的Sn-0.3Ag-0.7Cu(SAC0307)钎料具有较好的延展性、抗冲击跌落性能且成本低等优点,但也存在熔点高,力学性能和抗热疲劳性能低等问题导致其可靠性降低。为进一步促进电子封装用低银SAC0307钎料的发展,改善其力学性能和可靠性,新型低银SAC0307复合钎料的研究成为重要研究方向之一。简述近十年来国内外低银SAC0307复合钎料的研究现状,着重从添加合金元素、金属纳米颗粒、金属氧化物颗粒、碳纳米颗粒及其他非金属材料方面回顾总结了低银SAC0307钎料改性工作方面的研究成果,以期为后续研发高性能的新型低银SAC0307复合钎料提供一定的帮助。

With the increasing demand for lead-free and high integration of electronic packaging,the development of low-cost and high-performance lead-free packaging materials to effectively replace the traditional lead-containing materials has become a global focus.The Sn-0.3Ag-0.7Cu(SAC0307)solder with the lowest silver content in the currently developed Sn-Ag-Cu lead-free solder has the advantages of good ductility,impact drop resistance and low cost,but its reliability is reduced due to its high melting point,low mechanical properties and low thermal fatigue resistance.In order to further promote the development of low-silver SAC0307 solder for electronic packaging and improve its mechanical properties and reliability,the research of new low-silver SAC0307 composite solder has become one of the important research directions.The research status of SAC0307 composite solder with low silver content in recent ten years is elaborated.The research results on the modification of low-silver SAC0307 solder are reviewed and summarized from the aspects of adding alloy elements,metal nanoparticles,metal oxide particles,carbon nanoparticles and other non-metallic materials.It is expected to provide some help for the subsequent research and development of high-performance new low-silver SAC0307 composite solder.