超薄均热板的研究现状及发展趋势

Development Status and Perspective Trend of Ultrathin Vapor Chamber

随着第五代移动通信技术(5G技术)的出现与快速发展,电子产品尤其是智能手机、平板电脑等产品,越发朝着高性能、高集成和微型化的方向发展。功耗成倍的增长将导致电子芯片在狭小空间内产生过高的热流密度和工作温度,进一步引发严峻的热失控难题。超薄均热板具有优异的导热性能,较大传热面积、较好的均温性能和高可靠性等优点,是解决电子设备散热问题的首要途径。为满足5G时代下现代微型化电子设备散热需求,均热板进一步超薄化是当前业界和学术界的研究热点。基于此,对超薄均热板传热原理进行概述,重点综述国内外超薄均热板结构设计研究现状,包括气液通道排布结构和吸液芯结构等,介绍目前超薄均热板封装制造工艺,并分析其实现极端超薄化中存在的问题,最后对其在高集成超轻薄电子设备等散热领域的研究趋势和发展前景进行了科学的展望。

With the emergence and rapid development of the fifth-generation mobile communication technology(5G technology),electronics,especially smart phones and tablet PC,are developing increasingly towards high performance,high integration and miniaturization.This will result in ultrahigh heat flux and operating temperature in narrow space,further lead to serious thermal problems.Ultrathin vapor chamber(UTVC)with the advantages of outstanding thermal conductivity,large heat transfer area,good temperature uniformity and high reliability,is the primary method to solve this problem.To meet the heat dissipation requirement of modern miniaturized electronics under 5G era,the further ultrathin development of UTVCs have been the focus in current industry and academia.Based on this,the heat transfer mechanism of UTVCs is firstly summarized.The research status of UTVC structures,including gas-liquid channel arrangement and wick,is reviewed.Then,the packaging and manufacturing methods of UTVCs are introduced.Additionally,the problems existed in the extremely ultrathin development in UTVCs are pointed out.Finally,the research trend and development of UTVCs in heat dissipation fields of high integration and ultrathin electronics are prospected.