电子胶粘剂界面弱化的机理探讨及影响因素分析

Mechanism discussion and influencing factor analysis on interface weakening of electronic adhesive

对粘接理论和界面处的微观作用力进行了讨论,并对影响电子胶粘剂界面粘接强度的关键因素进行了探讨。本文研究认为,吸附理论、互锁理论和扩散理论描述的微观作用力对电子胶粘剂的粘接具有重要贡献,而静电理论和吸盘理论描述的微观作用力可以忽略不计;界面化学组成、润湿程度、界面污染、界面形貌、温度和中间相厚度会显著影响界面粘接力。最后从上述关键因素出发,结合相关工程经验,对电子胶粘剂的界面弱化机理进行了梳理。

The bonding theory and microscopic forces at the interface were discussed,and the key factors affecting the interfacial bonding strength of electronic adhesive were discussed as well. The research in this paper showed that the microscopic forces described by adsorption theory,interlocking theory and diffusion theory had important contributions to the bonding of electronic adhesive,while the microscopic forces described by electrostatic theory and suction theory could be ignored. The interfacial chemical composition,wetting degree,interfacial contamination,interfacial morphology,temperature and mesophase thickness could significantly affect the interfacial bonding force. Finally,based on the above key factors and combined with relevant engineering experience,the interface weakening mechanism of electronic adhesive was reviewed.