波峰焊接时间测量方法研究

Study on Measurement of Welding Time in Wave Soldering Machine

作为电子制造最常见的生产设备之一,波峰焊是将PCB插件板的焊接面直接与高温液态锡接触,以达到焊接目的。PCB板面和高温液态锡料的接触时间是关键参数,必须控制在合理范围来保证焊接质量且减少高温影响器件寿命。设备作业指导书对PCB在锡炉的浸锡时间范围有明确要求,需要采取特定的方法进行测量并判断是否符合工艺规范。

As one of the most common production equipment in electronic manufacturing,wave soldering machine directly contacts the welding surface of PCB with high-temperature liquid tin to achieve the purpose of welding.The contacting time between PCB surface and high temperature liquid tin is a key parameter,which must be controlled within a reasonable range to ensure welding quality and reduce the impact of high temperature on device life.The equipment operation instruction has clear requirements for the welding time range.It is necessary to take specific methods to measure and judge whether it meets the process specification.