有限元仿真在电装工艺可靠性工程中的应用

Application of Finite Element Simulation in Reliability Engineering of Electronic Assembly Process

电子装联工艺(简称“电装工艺”)是实现电子产品核心电子组件PCBA的关键制造环节和基本流程。现阶段通常需要进行大量的可靠性试验来验证电子装联工艺的可靠性,有限元软件的出现为此类问题的解决提供了较为简单准确的途径。综述了有限元仿真技术在电子装联工艺可靠性工程中的应用。简要介绍了有限元仿真分析流程,以典型BGA器件板级组装焊点热疲劳评价为例,分析了其基于有限元方法的评价流程。分别列举了有限元仿真方法在电子装联工艺可靠性工程相关的工艺设计、工艺参数优化、互连可靠性评价、失效根因分析环节中的应用以及优势所在,为电子装联工艺可靠性的研究提供一定的理论依据。

Electronic assembly process is the key manufacturing link and basic process for realizing PCBA,the core electronic component of electronic products.At this stage,a large number of reliability experiments are usually required to verify the reliability of the electronic assembly process.The emergence of finite element software provides a relatively simple and accurate way to solve such problems.The application of finite element simulation technology in the reliability engineering of electronic assembly process is summarized.The finite element simulation analysis process is briefly introduced.Taking the thermal fatigue evaluation of typical BGA device board-level assembly solder joints as an example,the evaluation analysis process based on the finite element method is reviewed.The application and advantages of finite element simulation method in the process design of electronic assembly process reliability engineering,process parameter optimization,interconnection reliability evaluation,failure root cause analysis and other links are respectively listed,which provides a theoretical basis for the research of electronic assembly process reliability.