摘要
描述了一种基于锁相合成的高密度频综系统级封装(SiP)的设计思路和问题分析。综合运用电路、电磁、热、力等多维度物理量进行协同仿真和工程分析,在RF类产品不断小型化的趋势下,不断探索和开拓设计边界。高密度频综SiP的技术指标达到项目的技术要求,已应用于多项工程课题。
The design idea and problem analysis of a high density frequency synthesis SiP based on phase-locked synthesis is described.The multi-dimensional physical quantities such as circuit,electromagnetism,heat and force are comprehensively used for collaborative simulation and engineering analysis,in the trend of continuous miniaturization of RF products,the design boundary is constantly explored and explored.The technical index of high density frequency synthesis SiP meets the technical requirements of the project and has been applied in many other projects.
作者
王燕
苏梦蜀
WANG Yan;SU Mengshu(The 29th Research Institute of CETC,Chengdu 610036,China)
出处
《电子工艺技术》
2022年第5期259-261,274,共4页
Electronics Process Technology
关键词
频综
系统级封装
电磁
热力学
模式
frequency synthesizer
system in package
electromagnetism
thermodynamic
mode
