摘要
将咪唑、2-苯基咪唑、4-苯基咪唑和苯并咪唑作为原料,与仲胺化合物和1,4-丁二醇二缩水甘油醚反应分别得到咪唑季铵盐化合物(IABDGE)、2-苯基咪唑季铵盐化合物(TPIABDGE)、4-苯基咪唑季铵盐化合物(FPIABDGE)和苯并咪唑季铵盐化合物(BIABDGE)。通过循环伏安、线性扫描伏安、电化学阻抗谱和计时电位曲线测试,研究了它们对盲孔电镀过程中铜电沉积行为的影响。结果表明,BIABDGE的整平能力最好,将其用于盲孔电镀铜时填充率高达98.91%。
Four kinds of quaternary ammonium salts based on imidazole,2-phenylimidazole,4-phenylimidazole,and benzimidazole(remarked as IABDGE,TPIABDGE,FPIABDGE,and BIABDGE,respectively)were synthesized by using the said imidazole and its derivatives,secondary amine,and 1,4-butanediol diglycidyl ether as reactants.The effects of the said levelers on the electrodeposition behavior of copper during blind via filling were studied by cyclic voltammetry(CV),linear scanning voltammetry(LSV),electrochemical impedance spectroscopy(EIS),and chronopotentiometry.The results showed that BIABDGE had the best leveling capability with a filling rate of 98.91%when applied to copper electroplating of blind via.
作者
何晓桐
谭伟
陈泳
华子如
罗勇葳
潘文龙
HE Xiaotong;TAN Wei;CHEN Yong;HUA Ziru;LUO Yongwei;PAN Wenlong(School of Chemical Engineering and Light Industry,Guangdong University of Technology,Guangzhou 510006,China;Guangdong Provincial Key Laboratory of Chemical Measurement and Emergency Test Technology,Institute of Analysis,Guangdong Academy of Sciences(China National Analytical Center,Guangzhou),Guangzhou 510070,China)
出处
《电镀与涂饰》
CAS
北大核心
2022年第17期1237-1244,共8页
Electroplating & Finishing
关键词
盲孔
电镀铜
整平剂
咪唑
电化学分析
填充率
blind via
copper electroplating
leveler
imidazole
electrochemical analysis
filling rate
