服务器板DIMM孔爬锡高度关键影响因子研究

Study on the key factors influencing the tin climbing height of DIMM holes on server modules

服务器板中双列直插内存模块(DIMM)会选择使用有机可焊保护膜(OSP),而在焊接过程中印制电路板DIMM孔内的孔壁上对OSP膜的兼容性要求更高,若孔内的OSP膜未及时被助焊剂完全溶解,导致气体逸出不充分,是焊点中产生较大空洞、爬锡高度不足的一个原因,另外印制电路板DIMM孔内若存在孔破、印制电路板孔内裸露的基材中的气体逸出也是导致焊点中产生较大空洞、爬锡高度不足的一个原因,文章根据一种DIMM(双列直插内存模块)孔爬锡失效阐述如何分析以及改善。

Server board can choose to use organic protective film(OSP).In the welding process of Printed Circuit Board,the requirement of OSP membrane compatibility requirements is higher on the hole wall of DIMM holes.If the hole of the OSP membrane is not completely dissolved by flux in time,it will lead to insufficient gas evolution,large hole in the solder joints.One reason of not enough tin of PCB DIMM because of any broken hole.This paper make analysis and put forward improvement methods.