摘要
通过对金刚石颗粒表面进行镀膜和热处理,可解决高导热金刚石/铜复合材料的界面润湿和结合问题。本文研究了金刚石颗粒表面磁控溅射镀覆改性金属Mo和W以及不同热处理工艺对镀覆金刚石颗粒质量、表面形貌、微观组织和相组成的影响规律。结果表明:磁控溅射后Mo镀层呈现麦粒状组织,而W镀层为球形颗粒状组织;在真空环境下热处理时,热处理温度的增加会加速Mo或者W的升华速率,使得金刚石颗粒表面裸露在热处理环境中而发生石墨化。在Ar环境下对镀覆金刚石颗粒进行热处理,900℃时还有少量Mo或者W单质相残留在金刚石颗粒镀覆表面,当温度升高到950℃时金刚石颗粒出现了石墨化现象,但热处理温度为1000℃时形成了致密的MoC_(x)和WC_(x)相,消除了石墨化现象,并获得了良好的热处理界面。
The surface coating and heat treatment of diamond particles can solve the problem of high performance interface wetting and combination of high thermal conductivity diamond/copper composites.In this paper,the effects of magnetron sputtering surface coating modified metals Mo and W,and different heat treatment processes on the mass,surface morphology,microstructure and phase composition of coated diamond particles were studied.The results show that Mo coating presents wheat grain structure after magnetron sputtering,while W coating has spherical grain structure;In vacuum environment,with the increase of heat treatment temperature,the sublimation rate of Mo or W will be accelerated,and graphitization will occur on the surface of diamond particles exposed in the environment of heat treatment.After heat treatment of coated diamond particles in Ar environment.At 900℃,small amount of Mo or W remains on the plated surface of diamond particles,respectively.Graphitization of diamond particle occurs when the temperature rises to 950℃.However,dense MoC_(x) and WC_(x) phases form when the heat treatment temperature is 1000℃.The graphitization phenomenon is eliminated and a good heat treatment interface is obtained.
作者
王长瑞
田威
胡俊山
李波
李鹏程
林铁松
廖文和
WANG Chang-rui;TIAN Wei;HU Jun-shan;LI Bo;LI Peng-cheng;LIN Tie-song;LIAO Wen-he(National Key Laboratory of Science and Technology on Helicopter Transmission,Nanjing University of Aeronautics and Astronautics,Nanjing 210016,China;State Key Laboratory of Advanced Welding and Joining,Harbin Institute of Technology,Harbin 150001,China)
出处
《中国有色金属学报》
EI
CAS
CSCD
北大核心
2022年第7期1991-2005,共15页
The Chinese Journal of Nonferrous Metals
基金
国家自然科学基金资助项目(52075250)
先进焊接与连接国家重点实验室开放课题研究基金资助项目(AWJ-22M13)
中国博士后科学基金资助项目(2020M683376)。