期刊文献+

一种无铅焊点可靠性验证经济模型

An Economic Model of Lead-free Solder Joint Reliability Verification
下载PDF
导出
摘要 电子产品质量的核心所在是印制电路板的焊点质量。随着内外部环境的不断变化,必须采用绿色、可靠的焊接工艺,满足环境要求,确保产品质量。本文结合产品的服役条件和可靠性要求,介绍工控系统产品无铅工艺切换过程中焊点可靠性验证的一种经济模型。 Solder joint quality of printed circuit board is the core of the electric product quality. With the constant change of internal and external environment, green and reliable soldering process must be used to meet environmental requirements and ensure product quality. This paper introduces an economic model of solder joint reliability verification in Industrial Control System soldering switching process,then combining the service conditions and reliability requirements of Industrial Control System.
作者 钱瑞霞 马惠芳 黄静洁 钱燕翔 梅超 Qian Ruixia;Ma Huifang;Huang Jingjie;Qian Yanxiang;Mei Chao(Zhejiang SUPCON Co.,Ltd.,Hangzhou Zhejiang 310053)
出处 《中国仪器仪表》 2022年第7期38-42,共5页 China Instrumentation
关键词 焊点 可靠性 Solder joint Reliability

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部