基于Icepak分析的特种机箱散热孔造型设计

Modeling design of cooling hole of special cabinet based on Icepak analysis

对特种机箱的散热孔进行设计,从形式角度梳理散热孔造型特征,从功能角度研究电子设备散热孔与造型特征间的关系,通过Icepak软件分析外观模型,计算其内部温度,设计出3种散热孔方案。结果显示:3种设计方案均满足形式美法则,其机箱内CPU监控点的温度分别为47.75,46.68,46.90℃,选择温度最低的散热孔为最佳设计方案。结果表明:散热孔的设计是外观和功能的结合,合理的散热孔形状会促进特种机箱内热量的排出,增强散热效果,设计方法可推广应用到其他相关产品设计领域。

The design of heat sink holes of the special chassis was carried out.The modeling features of the heat sink holes was combed.The relationships between the heat sink holes and the shape features of electronic equipment were studied from the formal perspective.The appearance model was analyzed by Icepak software to calculate its internal temperature to analyze three optimal heat sink hole schemes.The results showed that all three design solutions satisfied the law of formal beauty.The temperature of CPU monitoring point inside its case were 47.75,46.68,46.90 ℃,respectively.The heat sink hole with the lowest temperature was selected as the best design solution.The results showed that the design of heat sink hole was a combination of appearance and function.Reasonable shape of the heat sink hole would promote the discharge of heat from the special case and enhance the heat dissipation effect.The design method could be spreaded and applied to other related product design fields.