基于切比雪夫拟合的倒装焊接机调平

Leveling of Flip Chip Welding Machine Based on Chebyshev Fitting

为了解决倒装焊接机在芯片基板焊接中焊接面不平行的问题,提出了一种基于切比雪夫拟合的倒装焊调平算法,通过切比雪夫拟合实现上下调平面的拟合,然后计算两平面的角度偏差量,最后使用调平机构实现角度的调节。该方法减少了调平次数,而且缩短了调平时间,在实际倒装焊工艺试验中提高了生产效率和成品率。

In order to solve the problem of parallelism of two welding surfaces in chip substrate welding,this paper proposes an upside-down welding leveling algorithm based on Chebyshev fitting,which realizes the fitting of the upper and lower adjustment planes by Chebyshev fitting,and then calculates the angular deviation of the two planes,and finally using the leveling mechanism to achieve angle adjustment.This method reduces the number of leveling times,and shortening the leveling time.In the actual reverse welding process test,the productivity and yield are improved.