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Recent progress on thermal conductivity of graphene filled epoxy composites 被引量:1

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摘要 With the rapid development of the electronic industry, the requirements for packaging materials with high thermal conductivity(TC) are getting higher and higher. Epoxy is widely used as package material for electronic package applications. But it’s intrinsic TC can’t meets the increasing demands. Adding high TC graphene into epoxy matrix is a proper way to reinforce epoxy composites. This review focuses on the filler modification,preparation process and thermal properties of graphene-filled epoxy resin composites. Different ways of covalent and non-covalent modification methods are discussed. The various kinds of graphene coating layer are also summarized. Then we analysis the hybrid filler system in epoxy composite. We hope this review will provide guidance for the development and application of graphene-filled epoxy resin composites.
出处 《Nano Materials Science》 EI CAS CSCD 2022年第3期205-219,共15页 纳米材料科学(英文版)
基金 supported by The National Key Research and Development Program of China (2020YFA0210704)。
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