摘要
The poly(epoxy-N-methylaniline)conductive organic carrier was used as the bonding phase of the low-temperature conductive silver paste.Then,this was mixed with different proportions of silver powder to prepare the low-temperature conductive silver paste.Afterwards,the effect of the conductive organic carrier on the properties of the low-temperature conductive silver paste was determined by IR,DMA and SEM.The results revealed that the prepared conductive paste has good conductivity,film-forming performance,printing performance,low-temperature curing performance,and anti-aging performance.When the mass percentage of the bonding phase/conductive phase was 40/60,the lowest volume resistivity of the conductive silver paste was 4.9×10^(−6)Ω⋅cm,and the conductivity was the best.
基金
fund for this work was provided by the“Research on Key Technologies of Photosensitive Conductive Silver Paste Based on Domestic Circuit Protection Micro Chip Components”(Project No.BE2020008 and Supporting Author:Chen P).
