期刊文献+

基于差分传热法的灯具峰值温度评估与分析

Evaluation and Analysis on Peak Temperature of Luminaires Based on Differential Heat Transfer Method
原文传递
导出
摘要 为通过计算方法来评估LED灯具工作时的峰值温度,本文在设计一款新型大功率LED灯具基础上,在球坐标下建立灯具的空间数学模型,利用有限差分法计算灯具不同位置处的温度分布,然后采用流体仿真软件对模型进行散热分析,得到灯具不同部件处的温度云图和监测点处的温度仿真数值。最后将计算结果与流体仿真结果进行对比,验证了有限差分计算方法的准确性和实用性。为灯具结构的散热设计提供了一种全新的计算方法理论。 To study a calculation method to evaluate the peak temperature of LED luminaire during operation,this article is designing a new type of luminaire based on the power LEDs,the spatial mathematical model of the luminaire established under spherical coordinates.The temperature distribution at different positions of the luminaires is calculated by the finite difference method,and then the fluid simulation software is used to analyze the heat dissipation of the model,and the temperature cloud diagrams and the temperature simulation value at the monitoring point at different parts of the luminaire are obtained.Finally,the calculation results are compared with the fluid simulation results to verify the accuracy and practicability of the finite difference calculation method.A new calculation method theory is provided for the heat dissipation design of the luminaire structure.
作者 晁俊杰 胡洪义 沈达 郁新新 牛绪儒 CHAO Junjie;HU Hongyi;SHEN Da;YU Xinxin;NIU Xuru(Lianyungang JARI Electronics Co.,Ltd.,Lianyungang 222000,China)
出处 《中国照明电器》 2022年第2期25-30,共6页 China Light & Lighting
关键词 LED灯具 差分传热 热仿真 结构设计 散热设计 流体仿真 LED luminaire differential heat transfer thermal simulation structural design heat dissipation design fluid simulation
  • 相关文献

参考文献4

二级参考文献21

  • 1Alvin C,Chu W, Cheng C H, et al. Thermal analysis of extruded aluminum fin heat sink for LED cooling application[C]//Proe, of IEEE 6th Microsystems, Packaging, Assembly and Circuits Teehnol. Conf., 2011: 397-400.
  • 2Gondipalli S, Sammakia B, Lu S, et al. Fin-shape optimization of an impingement-parallel plate heat sink [ C ]// Proc. of IEEE 12th Thermal and Thermomechanical Phenomena in Electron. Systems, 2010: 1-10.
  • 3Arik M,Petroski J,Weaver S. Thermal challenges in the future generation solid state lighting application:light emitting diodes[A].2002.113-120.
  • 4高圆圆.GH_4型LED路灯散热器传热研究[D]{H}重庆:重庆大学,201110-25.
  • 5David G. Pelka,Kavita Patel. An overview of LED applications for general illumination[A].2004.15-26.
  • 6J.Y.Tsao. Lighting emitting diodes (LEDs) for general illumination update 2002[M].Optoelectronics Industry Development Association,Washington D.C,2002.
  • 7Ⅲ-Vs Review. Improving LED heat dissipation[J].{H}International Journal of Thermal Sciences,2011.3.
  • 8L. Dialameh,M. Yaghoubi,O. Abouali. Natural convection from an array of horizontal rectangular thick fins with short length[J].{H}THERMAL ENGINEERING,2008.2371-2379.
  • 9杨世铭;陶文铨.传热学[M]{H}北京:高等教育出版社,2003.
  • 10J.T.Hsu,W.K.Han,C.Chen, et al.“Design of multi-chips LED module for lighting application”. Proceedings of SPIE the International Society for Optical Engineering . 2002

共引文献32

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部