摘要
建立了某混合微电子模块粘接失效分析模型,探索了载板尺寸、温度对可伐载板粘接性能的影响律。通过采用仿真模拟分析的方法,研究了在不同工况下导电胶粘接面的应力分布情况,并分析了应力变形与温度随时间的影响规律,不仅得到了载板尺寸大小和粘接可靠性、温度变化范围与粘接性能均为负相关的结论,且可以为后续研究提供参考。
The bonding failure analysis model of a hybrid microelectronics module is established, and the influence law of load plate size and temperature on the bonding performance of the felled load plate is explored.Through simulation analysis, the stress distribution of conductive adhesive joints under different working conditions was studied, and the influence of stress deformation and temperature with time was analyzed, It is not only concluded that the size of the carrier plate, the bonding reliability, the temperature range and the bonding performance are negatively correlated, but also can provide a reference for the subsequent research.
作者
李政
孔令磊
姬峰
张鹏哲
胡科
LiZheng;Kong Linglei;Ji Feng;Zhang Pengzhe;Hu Ke(Institute No.25 of the Second Academy China Aerospace Science and Industry Corporation,Beijing 100854,China;The First Military Representative Office of the Air Force Armament Department in Beijing,Beijing 100854,China)
出处
《科学技术创新》
2022年第30期189-192,共4页
Scientific and Technological Innovation
关键词
导电胶
可伐载板
温度幅度
可靠性能
conductive adhesive
variable carrier plate
temperature amplitude
reliability
