MCU内部DAC修调电路设计及其修调方法

Design of DAC Trimming Circuit and Its Trimming Method in MCU

针对芯片制造工艺存在的不稳定性以及芯片的个体性能差异化问题,提出一种在MCU内部增加修调控制电路的设计方法,并基于此修调电路设计一套特定的修调方法。设计以内部DAC模块为例,通过分析其控制电路中的自锁机制,探讨引导区程序划分及其功能实现,使用模块特定的修调方法获得修调值,并将数据固化在FLASH中,实现每颗芯片的可变式调节功能。通过在Cadence中完成整体电路模型仿真,验证设计与方法的合理性,为MCU应用领域的DAC修调相关实践提供有效的理论支撑。

Aiming at the instability of the chip manufacturing process and the individual performance difference of the chips, a design of adding a trimming control circuit in MCU is proposed, and a specific trimming method is designed based on the trimming circuit. Taking the internal DAC module as an example, by analyzing the self-locking mechanism in its control circuit, the program division of the boot area and its function realization are discussed. The module-specific tuning method is used to obtain the trimming value, and the data is solidified in FLASH to realize the variable trimming function of each chip.Through the simulation of the whole circuit model in Cadence, the rationality of the design and method is verified, which provides effective theoretical support for the practice of DAC trimming in MCU application field.